Advances in 3d Integrated Circuits and Systems (Hardcover)
3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book,Advances in 3D Integrated Circuits and Systems,is written to help readers understand 3D integrated circuits in three stages: device basics,system level management,and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal,power and I/O management; and 3D designs of sensors,I/Os,multi-core process